Abstract：TiN-Cu composite films were deposited on stainless substrates at different arc current and deposited time, using a type of multi-arc ion plating system. The surface morphology, cross-sectional morphology, phase structure and hardness of composite films were characterized. The results show that, with increasing in the Cu content, metallic Cu can inhibit the columnar growth and change the preferred orientation of pure TiN films. The highest value of composite film hardness is obtained with 12.96at% Cu, when deposited time is 2h and negative pulse bias is 200V. Cu content and deposition condition have a great impact on the hardness of composite films.
