The processing quality of spiral groove on sealing ring has a significant effect on the performance of dry gas seal. In order to obtain high spiral groove processing quality and provide an effective guidance on spiral groove processing technology, Silicon carbide (SiC) ceramic materials and tungsten carbide (WC) cemented carbide materials, which are commonly used in dry gas seals, are selected to study the laser processing technology of spiral groove by LM-20 fiber laser marking machine. The influence of laser power, scanning velocity, filling spacing, repetition frequency, marking number and other parameters on spiral groove depthhgand bottom surface roughnessRaare analyzed. The results of orthogonal test for WC are investigated with the conditions of that the laser power, scanning velocity, repetition frequency, number of marking are treated as variables and three levels are taken respectively. The experimental results show that the processing parameters have some influence on the spiral groove depthhgand the bottom surface roughnessRa, the reasonable process parameters can improve the processing quality of spiral groove. The reasonable parameters of SiC and WC sealing ring obtained by this test are listed as follow: the laser power are 8~10 W and 12~14 W, the scanning speed are 600~1 000 mm/s and 500~800 mm/s, the filling distance is 0.01~0.014 mm, the repetition frequency are 50~60 kHz and 20~30 kHz, the marking number are 4~6 times and 2~4 times. The results of orthogonal test show that the repetition frequency has the most significant effect on the groove depthhg, followed by the number of marking times, scanning speed and laser power. The scanning velocity has a significant effect on the bottom surface roughnessRa, while other factors can be neglected forRa. The interaction between marking number and laser power, laser power and scanning velocity, scanning velocity and repetition frequency are minute, and they have a little influence on the processing accuracy of the groove bottom.
