In this paper, a new kind of head structure and motion mechanism were developed by integrating synthetically a crank-rocker mechanism and a head face eccenter mechanism, that realize the operating functions of LED chip die bonders to drive chip of, such as picking up, carrying and bonding. Firstly, the working process and requirements of the head assembly were analyzed, the working theory of the head mecahniam was studied, the motion parameters of the crank-rocker mechanism were designed, a head face eccenter mechanism was developed, the motion time sequence of the excutive mechanisms was discussed. Secondly, the parts and assembly of the head structure and motion mechanism were designed by using pro/Engineer, the mechanim motion models and driving models were built, the motion simulation of the head mechanism was realized by using Mechanism/pro, the simulation results were analized, the head structure and mechanism parameters were optimized. Finally, the feasibility and rationality of the designed head mechanism and its simulation models were verified by testing the physical prototype, the developed head mechanism has been used in the whole equipment successfully, the performances of whole equipment have risen significantly.
